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Intel mPGA604 - page 1
R Docum ent Number : 254239-001 mPGA604 Socket Design Guidelines Revision 1.0 October 2003 ...
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Intel mPGA604 - page 2
R 2 mPGA604 Socket Des ign G uidelines Notice: This doc umen t contai ns inform ation o n product s in the design p hase o f develo pment. T he inform ation here i s subje ct to chan ge w ithout no tice. Do not finali ze a de sign with this inform ation. Co ntact you r local Intel sales o ffice o r your dist ributor t o obtain t he latest specifi c ...
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Intel mPGA604 - page 3
R mPGA604 Socket Des ign G uidelines 3 Contents 1 Introduction ................................................................................................................... .... 9 1.1 Objec tive ................................................................................................................ 9 1.2 Purpose ...................... ...
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Intel mPGA604 - page 4
R 4 mPGA604 Socket Des ign G uidelines 5 Environmental Requirem ents ........................................................................................ 29 5.1 Porosit y Test ........................................................................................................ 30 5.1.1 Porosit y Test Method .................................. ...
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Intel mPGA604 - page 5
R mPGA604 Socket Des ign G uidelines 5 Tables 2-1 Pack age Critical- To-Func tion (CT F) Dim ensions ................................................ 11 3-1 Sock et Critical-to-Funct ion Dim ensions ............................................................... 17 4-1 Electric al Requirem ents f or Sockets ......................................... ...
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Intel mPGA604 - page 6
R 6 mPGA604 Socket Des ign G uidelines Re vision Histor y Revision Number Description Date 1.0 • Initial releas e of the document. October 2003 ...
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Intel mPGA604 - page 7
R mPGA604 Socket Des ign G uidelines 7 Re-Validati on N otice to S ocket Vendor s Any significant change to the socket will require submission of a detailed explanation o f the change at least 60 days prior to the planned implementation. Intel will review the modification and establish the necessary re-validation procedure th at the socket must pas ...
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Intel mPGA604 - page 8
R 8 mPGA604 Socket Des ign G uidelines This page intent ion al l y left bla n k . ...
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Intel mPGA604 - page 9
R mPGA604 Socket Des ign G uidelines 9 1 Introduction 1.1 Objecti ve This document def ines a surf ace mount, Zero In sertion Force (ZIF ) socket intended for w orkstation and serv er platforms bas ed on future In tel microprocess ors. The socket prov ides I/O, pow er and groun d contacts. The socket contains 604 contacts array ed about a cav ity i ...
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Intel mPGA604 - page 10
Introduct ion R 10 mPGA604 Socket Des ign G uidelines This page intent ion al l y left bla n k . ...
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Intel mPGA604 - page 11
R mPGA604 Socket Des ign G uidelines 11 2 Assembled Component and Package Description Inform ation provided in this secti on is to ensu re dimension al compatibility of the m PG A604 sock et with that of the 604-pin processor packag e. The processor packag e must be inserted i nto the mPGA604 s ocket with zero insert ion force when the s ocket is n ...
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Intel mPGA604 - page 12
Assemb led Com pon ent an d Pack ag e Des cr iptio n R 12 mPGA604 Socket Des ign G uidelines This page intent ion al l y left bla n k . ...
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Intel mPGA604 - page 13
R mPGA604 Socket Des ign G uidelines 13 3 Mechanical Requirements 3.1 Mechanical Sup ports A retention system needs to isolate any load in exces s of 50 lbf, compressive, f rom the socket during the shock and vi bration conditions outlined in Sections 5. The socket must pass the me chan ical shock and vibration requireme nts li sted in Sections 5 w ...
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Intel mPGA604 - page 14
Mechanic al Requir ements R 14 mPGA604 Socket Des ign G uidelines Proper s eating 3.5 Markings All markings required in this section must be able to withsta nd a temperature of 240 ° C f or 40 seconds (m inimum) typical of a reflow prof ile for solder material used on th e socket, as well as any environmental test proced ure o utlined in Sectio n ...
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Intel mPGA604 - page 15
R Mechanic al Requir ements mPGA604 Socket Des ign G uidelines 15 3.6 Socket Size The socket size must m eet the di mensions as shown in Figure A-5 and Figure A-6, allow ing full insertion of the pins in the socket, without interference between the socket and the pin field. The mPGA604 s ocket and actuat ion area must fit wi thin the keep-in zone d ...
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Intel mPGA604 - page 16
Mechanic al Requir ements R 16 mPGA604 Socket Des ign G uidelines 3.9.6 Lubricants For the final assembled prod uct, no lubricant is per mitted on the socket contacts. If lubricants are used elsewhere within the s ocket asse mbly, these lubricants must not be able to migrate to the socket contacts. 3.10 Material and Rec ycling Req uirements Cadmium ...
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Intel mPGA604 - page 17
R Mechanic al Requir ements mPGA604 Socket Des ign G uidelines 17 3.16 Critical-to -Function Dime nsion s The mPGA604 s ocket shall accept a 604-pin processor pin f ield. All dimensions are metric. Asymmetric features are design ed to properly align the socket to the motherboard and pre vent the socket from being as sembled incorrectly to the m oth ...
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Intel mPGA604 - page 18
Mechanic al Requir ements R 18 mPGA604 Socket Des ign G uidelines This page intent ion al l y left bla n k . ...
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Intel mPGA604 - page 19
R mPGA604 Socket Des ign G uidelines 19 4 Electrical Requirements Socket electrical requirements are m easured from the socket-seating plane of the processor test vehicle (PTV) to the component side of the socket P CB to which it is attached. All specific ations are maximum values (unl ess otherwise stated) for a sing le socket pin, but includes ef ...
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Intel mPGA604 - page 20
Electr ical Requ irements R 20 mPGA604 Socket Des ign G uidelines 4.1 Electrical Resis tance Figure 4- 1 and Figu re 4-2 show the proposed m ethodology for measu ring the fi nal electrical resist ance. The methodol ogy requires measuring in terposer flu sh-mounted di rectly to th e motherboard fi xtures, so that the pin shou lder is flush with the ...
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Intel mPGA604 - page 21
R Electr ical Requ irements mPGA604 Socket Des ign G uidelines 21 Figure 4-3. Electri cal Resi stance Fi xtures Sup erimp osed ...
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Intel mPGA604 - page 22
Electr ical Requ irements R 22 mPGA604 Socket Des ign G uidelines Table 4- 3. Resistanc e Test F ixtures Net list DC Endpoi nts Edgefingers: Hi Edgefingers: L ow Daisy Chain # of pins per chain Hi Low +I +V -V -I 1 14 AE2 AE16 A94 A93 A118 A117 2 14 AE29 AE16 A136 A135 A118 A117 3 16 AD1 AD16 A92 A91 A116 A117 4 14 AD30 AD16 A138 A137 A116 A117 5 1 ...
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Intel mPGA604 - page 23
R Electr ical Requ irements mPGA604 Socket Des ign G uidelines 23 Table 4- 3. Resistanc e Test F ixtures Net list (Cont inued) DC Endpoi nts Edgefingers: Hi Edgefingers: L ow Daisy Chain # of pins per chain Hi Low +I +V -V -I 16 12 B2 N2 A66 A67 A48 A47 17 10 AB3 N3 A86 A85 A50 A49 18 10 C3 N3 A68 A67 A50 A49 19 8 AA 4 N4 A84 A83 A52 A51 20 10 D4 N ...
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Intel mPGA604 - page 24
Electr ical Requ irements R 24 mPGA604 Socket Des ign G uidelines 4.2 Determination of Maximum Elec trical Resistanc e This section provides a guideli ne for the instruments used to take the measurements. Note: The inst rument sel ection should con sider the gu idelines in EIA 364-23A . 1. These measurem ents use a 4-wire technique, wh ere the inst ...
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Intel mPGA604 - page 25
R Electr ical Requ irements mPGA604 Socket Des ign G uidelines 25 Figure 4-4. Inductance Measur ement Fixture Cross-Section No Plane o n this La yer Full Plane on this Layer Socke t Inter poser Motherboard 40 mils Probing Pads Surfac e No Features or Plane on this Layer Interposer Pin Short all L pins (using a solid plane) Interposer Shoulder Inter ...
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Intel mPGA604 - page 26
Electr ical Requ irements R 26 mPGA604 Socket Des ign G uidelines 4. Calibration – Cascade Ca libration Substrates or eq uivalent. 5. Measurement objects – pack ages, sockets , motherboards. Measurement Steps: • Equipment Set up Cables shou ld be connected to the network analy zer and to the probes u sing the appropriate torque w rench to ...
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Intel mPGA604 - page 27
R Electr ical Requ irements mPGA604 Socket Des ign G uidelines 27 for the socket. The shou lder of the interposer is not included in the electrical modeling. If there is any diff erence between them, it will be called the de-em bedded correction factor. Adding the interposer to the s ocket and then eliminating the contribu tion of the fixture creat ...
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Intel mPGA604 - page 28
Electr ical Requ irements R 28 mPGA604 Socket Des ign G uidelines This page intent ion al l y left bla n k . ...
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Intel mPGA604 - page 29
R mPGA604 Socket Des ign G uidelines 29 5 Environmental Requirements Design, including materials, shall be con sistent with the manufacture of units that meet the followi ng environm ental referen ce points . The reliability targets in this s ection are based on the expected field use environment for a desktop product. The test sequence for new soc ...
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Intel mPGA604 - page 30
Environme ntal Re quireme nts R 30 mPGA604 Socket Des ign G uidelines Table 5-1. Use Conditions Environment (Continued) Use Environment Speculative Stress Condition 7 Year Life Expectation 10 Year Life Expectation Fast, large gradient on/off to max operating tem p. (power cycle or internally heat ed i ncl udi ng power save features ). Power Cycle 7 ...
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Intel mPGA604 - page 31
R Environme ntal Re quireme nts mPGA604 Socket Des ign G uidelines 31 5.5 Durabilit y Use per EIA 364, test proce dure 09B. The s ame package pi n field is to be used f or 1st and 51st cycles. Measure cont act resistance when mated in 1st and 51st cy cles. A spare package pin f ield is used f or 2nd through 50th cycles. A pair of new package pin fi ...
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Intel mPGA604 - page 32
Environme ntal Re quireme nts R 32 mPGA604 Socket Des ign G uidelines This page intent ion al l y left bla n k . ...
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Intel mPGA604 - page 33
R mPGA604 Socket Des ign G uidelines 33 6 Validation Testing Requirements This section of the docu ment outlines the tests that must b e success full y completed in order for the supplier's s ocket to pass the design gu idelines validation. It provides the test plan an d procedure required for validation. 6.1 Applicable Doc uments EIA-364- C. ...
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Intel mPGA604 - page 34
Validati on Testing Require ments R 34 mPGA604 Socket Des ign G uidelines 6.7 Qualit y A ssura nce Requirem ents The OEM’s will work with the socket supp lier(s) the y choose to ensure socket quality. 6.8 Socket Test Pla n 6.8.1 Submission of an mPGA 604 Socket for Va lidation Testing The socket supplier 's mPGA604 so cket will be sent to In ...
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Intel mPGA604 - page 35
R mPGA604 Socket Des ign G uidelines 35 7 Safety Requirements Design, including materials, shall be con sistent with the manufacture of units that meet the follo wing safe t y stand ards: • UL 1950 m ost current editions. • CSA 950 m ost current edition. • EN60 950 most current edition and amendments. • IEC60 950 most current edition and am ...
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Intel mPGA604 - page 36
Safety Req uirements R 36 mPGA604 Socket Des ign G uidelines This page intent ion al l y left bla n k . ...
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Intel mPGA604 - page 37
R mPGA604 Socket Des ign G uidelines 37 8 Documentation Requirements The socket supplier shall pro vide Intel with the following documentation: • Multi-Line Coupled SPICE models for socket. • Product design guideli ne incorporating the requirements o f these design guideline s. • Recommended board lay out guidelines for the s ocket consistent ...
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Intel mPGA604 - page 38
Documentat ion Re quireme nts R 38 mPGA604 Socket Des ign G uidelines This page intent ion al l y left bla n k . ...
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Intel mPGA604 - page 39
R mPGA604 Socket Des ign G uidelines 39 A Appendix A Figure A-1. 42.5 mm, 604-Pin P ackage Assembly Draw ing ( Sheet 1 of 3) ...
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Intel mPGA604 - page 40
Append ix A R 40 mPGA604 Socket Des ign G uidelines Figure A-2. 42.5 mm, 604-Pin P ackage Assembly Draw ing ( Sheet 2 of 3) ...
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Intel mPGA604 - page 41
R Append ix A mPGA604 Socket Des ign G uidelines 41 Figure A-3. 42.5 mm, 604-Pin P ackage Assembly Draw ing ( Sheet 3 of 3) ...
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Intel mPGA604 - page 42
Append ix A R 42 mPGA604 Socket Des ign G uidelines Figure A-4. mPG A604 Socket Draw ing (Sheet 1 of 3) ...
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Intel mPGA604 - page 43
R Append ix A mPGA604 Socket Des ign G uidelines 43 Figure A-5. mPG A604 Socket Draw ing (Sheet 2 of 3) ...
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Intel mPGA604 - page 44
Append ix A R 44 mPGA604 Socket Des ign G uidelines Figure A-6. mPG A604 Socket Draw ing (Sheet 3 of 3) ...
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Intel mPGA604 - page 45
R Append ix A mPGA604 Socket Des ign G uidelines 45 Figure A-7. 603-Pin Interp oser Assembly Draw ing ( Sheet 1 of 7) ...
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Intel mPGA604 - page 46
Append ix A R 46 mPGA604 Socket Des ign G uidelines Figure A-8. 603-Pin Interp oser Assembly Draw ing ( Sheet 2 of 7) ...
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Intel mPGA604 - page 47
R Append ix A mPGA604 Socket Des ign G uidelines 47 Figure A-9. 603-Pin Interp oser Assembly Draw ing ( Sheet 3 of 7) ...
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Intel mPGA604 - page 48
Append ix A R 48 mPGA604 Socket Des ign G uidelines Figure A-10. 603-Pin Inter poser Assembly Draw ing ( Sheet 4 of 7) ...
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Intel mPGA604 - page 49
R Append ix A mPGA604 Socket Des ign G uidelines 49 Figure A-11. 603-Pin Inter poser Assembly Draw ing ( Sheet 5 of 7) ...
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Intel mPGA604 - page 50
Append ix A R 50 mPGA604 Socket Des ign G uidelines Figure A-12. 603-Pin Inter poser Assembly Draw ing ( Sheet 6 of 7) ...
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Intel mPGA604 - page 51
R Append ix A mPGA604 Socket Des ign G uidelines 51 Figure A-13. 603-Pin Inter poser Assembly Draw ing ( Sheet 7 of 7) ...
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Intel mPGA604 - page 52
Append ix A R 52 mPGA604 Socket Des ign G uidelines This page intent ion al l y left bla n k . ...
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