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Manuale per l’uso Intel 320028-001

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Summary
  • Intel 320028-001 - page 1

    Order Number: 320028-00 1 Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications Thermal Design Guide June 2008 ...

  • Intel 320028-001 - page 2

    Intel® Core™ 2 Duo Mobile Processors on 45-nm process fo r Embedded Applications TDG June 2008 2 Order Number: 320028-001 INFORMA TION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL ’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUC TS, INTEL ASSUMES NO LIABILITY WHA TSOEVER, AND INTEL DISCLAIMS ANY ...

  • Intel 320028-001 - page 3

    Core™ 2 Duo Mobile Processors—Contents Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 3 Order Number: 320028-001 Contents 1.0 Introducti on ......... ........... ........ ........... .......... ........... .......... ........... .......... ........... ....... 6 1.1 Design Flow ......... ... ....... ...

  • Intel 320028-001 - page 4

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 4 Figures—Core™ 2 Duo Mobile Processors Figures 1 Thermal Design P rocess ............ ........... .......... ........... .......... ............. ........... .......... ...... 7 2 Primary Side Keep Out Zone Requirements? ...

  • Intel 320028-001 - page 5

    Core™ 2 Duo Mobile Processors—Tables Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 5 Order Number: 320028-001 Revision History Date Revision Description June 2008 1.0 First Public release. ...

  • Intel 320028-001 - page 6

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 6 Introduction—Core™ 2 Duo Mobile Processors 1.0 Introduction The power dissipation of electronic components has risen along with the increase in complexity of computer systems. T o ensure quality , reliability , and perfo ...

  • Intel 320028-001 - page 7

    Core™ 2 Duo Mobile Processors—Introduction Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 7 Order Number: 320028-001 1.2 Definition of Terms Figure 1. Thermal Design Process Table 1. Definition of Terms (Sheet 1 of 2) Term Definition FCPGA Flip Chip Pin Grid Array . A pin grid ar ray packaging tec ...

  • Intel 320028-001 - page 8

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 8 Introduction—Core™ 2 Duo Mobile Processors 1.3 Reference Documents The reader of this specification should also be familiar with material and concepts presented in the following documents: • Intel® Core™2 Duo Proces ...

  • Intel 320028-001 - page 9

    Core™ 2 Duo Mobile Processors—Package Information Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 9 Order Number: 320028-001 2.0 Package Information The Intel® Core™2 Duo Processor (XE and SV) is av ailable in 478-pin Micro-FCPGA packages as well as 479-ball Micro-FCBGA packages. The Intel® Core ...

  • Intel 320028-001 - page 10

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 10 Thermal Specifications—Core™ 2 Duo Mobile Processors 3.0 Thermal Specifications 3.1 Thermal Design Power The Therm al Design P ower (TDP ) specification is listed in Ta b l e 2 . Heat transfer through the micro- FCBGA, ...

  • Intel 320028-001 - page 11

    Core™ 2 Duo Mobile Processors—Mechanical Specifications Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 11 Order Number: 320028-001 4.0 Mechanical Specifications 4.1 Package Mechanical Requirements 4.1.1 Die Pressure/Load Upper Limit From a die mechanical integrity standpoint, the m axi mum allowabl ...

  • Intel 320028-001 - page 12

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 12 Mechanical Specifications—Core™ 2 Duo Mobile Processors Notes: 1. Dimension in millimeters [inches]. Figure 2. Primary Side Keep Out Zone Requ ire ments— Micro-FCPGA ...

  • Intel 320028-001 - page 13

    Core™ 2 Duo Mobile Processors—Mechanical Specifications Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 13 Order Number: 320028-001 Notes: 1. Dimension in millimeters [inches]. Figure 3. Primary Side Keep Out Zone Requirements— Micr o-FCBGA ...

  • Intel 320028-001 - page 14

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 14 Mechanical Specifications—Core™ 2 Duo Mobile Processors Notes: 1. Dimension in millimeters [inches]. Figure 4. Se condar y Side Ke ep Out Zone Requirements ...

  • Intel 320028-001 - page 15

    Core™ 2 Duo Mobile Processors—Thermal Solution Requirements Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 15 Order Number: 320028-001 5.0 Thermal Solution Requirements 5.1 Thermal Solution Characterization The thermal characterization par ameter , Ψ (“psi”), is used to characterize thermal so ...

  • Intel 320028-001 - page 16

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 16 Thermal Solution Requirements—Core™ 2 Duo Mobile Processors 5.1.1 Calculating the Required Th ermal Performance for the Intel ® Core™2 Duo processor Overall thermal performance, Ψ JA, is then defined using the therm ...

  • Intel 320028-001 - page 17

    Core™ 2 Duo Mobile Processors—Thermal Solution Requirements Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 17 Order Number: 320028-001 It is evident from the above calculations that a reduction in the local ambient temperature can have a significant effect on the junction-to-ambient thermal resista ...

  • Intel 320028-001 - page 18

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 18 Reference Thermal Solutions—Core™ 2 Duo Mobile Processors 6.0 Reference Thermal Solutions Intel has developed reference thermal solutions de signed to meet the cooling needs of embedded form factor applications. This ch ...

  • Intel 320028-001 - page 19

    Core™ 2 Duo Mobile Processors—Reference Thermal Solutions Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 19 Order Number: 320028-001 6.2 Keep Out Zon e Requir ements The keep out zone requirements on the PC B to use this heatsink are detailed in Appendix B, “Mechanical Drawings” . Because it ex ...

  • Intel 320028-001 - page 20

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 20 Reference Thermal Solutions—Core™ 2 Duo Mobile Processors 6.4.1 Keep Out Zone Re qui r emen ts The keep out zone requ irements on the PCB to use this heatsink are detailed in Appendix B, “Mechanical Drawin gs” . Bec ...

  • Intel 320028-001 - page 21

    Core™ 2 Duo Mobile Processors—Reference Thermal Solutions Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 21 Order Number: 320028-001 6.5 Compact PCI Reference Heatsink The cPCI reference thermal solution is shown in Figure 10 . The maximum heatsink height is constrained to 8.7 mm. The heatsink uses ...

  • Intel 320028-001 - page 22

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 22 Reference Thermal Solutions—Core™ 2 Duo Mobile Processors 6.5.1 Keep Out Zone Re qui r emen ts The keep out zone requ irements on the PCB to use this heatsink are detailed in Appendix B, “Mechanical Drawin gs. ” Bec ...

  • Intel 320028-001 - page 23

    Core™ 2 Duo Mobile Processors—Reference Thermal Solutions Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 23 Order Number: 320028-001 Thermal interface materials have thermal impedance (resistance) that will increase as the material degrades ov er time. It is important for thermal solu tion designer ...

  • Intel 320028-001 - page 24

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 24 Thermal Metrology—Core™ 2 Duo Mobile Processors 7.0 Thermal Metrology The system designer must make temper ature measurements to accur ately determine the performance of the thermal solution. V alidation of the processo ...

  • Intel 320028-001 - page 25

    Core™ 2 Duo Mobile Proce ssors—Thermal Metrology Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 25 Order Number: 320028-001 It is worthwhile to determine the local ambient te mperature in the chassis around the processor to understand the effect it may ha ve on the case temperature. T LA is best me ...

  • Intel 320028-001 - page 26

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 26 Thermal Metrology—Core™ 2 Duo Mobile Processors Note: Drawing not to scale. Figure 13. Measuring T LA with an Active Heatsink ...

  • Intel 320028-001 - page 27

    Core™ 2 Duo Mobile Proce ssors—Thermal Metrology Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 27 Order Number: 320028-001 Note: Dra wing not to scale. Figure 14. Measuring T LA with a Passive Heatsink ...

  • Intel 320028-001 - page 28

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 28 Reliability Guidelines—Core™ 2 Duo Mobile Processors 8.0 Reliability Guidelines Each motherboard, heatsink, and attach combin ation ma y vary the mechanical loading of the component. The user should carefully evaluate t ...

  • Intel 320028-001 - page 29

    Core™ 2 Duo Mobile Processors—Thermal Solution Component Suppliers Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 29 Order Number: 320028-001 Appendix A Thermal Solution Compo nent Suppliers These vendors and devices are listed by Intel as a convenience to Intel’ s gener al customer base. Intel d ...

  • Intel 320028-001 - page 30

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 30 Mechanical Drawings—Core™ 2 Duo Mobile Processors Appendix B Mechanical Drawings Ta b l e 6 lists the mechanical drawings included in this appendix. Table 6. Mechanical Drawings Description Figure Advanced T CA* Referen ...

  • Intel 320028-001 - page 31

    Core™ 2 Duo Mobile Processors—Mechanical Drawings Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 31 Order Number: 320028-001 Figure 15. AdvancedTCA* Refer ence Heatsink PCB Keep Out Zone Requireme nts (Sheet 1 of 2) ...

  • Intel 320028-001 - page 32

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 32 Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 16. AdvancedTCA* Refere nce Heatsink PCB Keep Out Zone Require ments (Sheet 2 of 2) ...

  • Intel 320028-001 - page 33

    Core™ 2 Duo Mobile Processors—Mechanical Drawings Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 33 Order Number: 320028-001 Figure 17. AdvancedT CA* Reference Heatsink A ssembly ...

  • Intel 320028-001 - page 34

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 34 Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 18. AdvancedTCA* Re ference Heatsink ...

  • Intel 320028-001 - page 35

    Core™ 2 Duo Mobile Processors—Mechanical Drawings Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 35 Order Number: 320028-001 Figure 19. CompactPCI* Refer ence Heatsink PCB Keep O ut Zone Requirements (Sheet 1 of 2) ...

  • Intel 320028-001 - page 36

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 36 Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 20. CompactPCI* R eference Heatsink PCB Keep Out Zone Re quirements (She et 2 of 2) ...

  • Intel 320028-001 - page 37

    Core™ 2 Duo Mobile Processors—Mechanical Drawings Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 37 Order Number: 320028-001 Figure 21. CompactPCI* Reference Heatsink Assembly ...

  • Intel 320028-001 - page 38

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 38 Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 22. CompactPCI* R eference Heatsink ...

  • Intel 320028-001 - page 39

    Core™ 2 Duo Mobile Processors—Mechanical Drawings Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 39 Order Number: 320028-001 Figure 23. 1U Reference He atsink PCB Keep Out Require ments (Sheet 1 of 2) ...

  • Intel 320028-001 - page 40

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 40 Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 24. 1U Ref erence Heatsink PCB Keep Out Requirement s (Sheet 2 of 2) ...

  • Intel 320028-001 - page 41

    Core™ 2 Duo Mobile Processors—Mechanical Drawings Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 41 Order Number: 320028-001 Figure 25. 1U Refe rence Heatsink Assembly ...

  • Intel 320028-001 - page 42

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 42 Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 26. 1U Re fe rence Heatsink ...

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