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Manual Intel 5400 Series

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  • Intel 5400 Series - page 1

    Reference Number: 3186 11 Revision: 001 Quad-Core Intel ® Xeon ® Processor 5400 Series Thermal/Mechanical Design Guidelines November 2007 ...

  • Intel 5400 Series - page 2

    2 Quad-Core Intel® Xeon® Processor 5400 Series TMDG IINFORMA TION IN THIS DOCUMENT IS PR OVIDED IN CONNECTION WITH INTEL® PRODUCTS . NO LICENSE, EXPRES S OR IMPLIED, BY EST OPPEL OR OTHERWISE, T O ANY INTELLECTUAL PROPER TY RIGHT S IS GRANTED BY THIS DOCUMENT . EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDIT IONS OF SALE FOR SUCH PR ODUCTS, ...

  • Intel 5400 Series - page 3

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 3 Contents 1I n t r o d u c t i o n ......... ......... ........ ........... ........ ........... ........ ........ ........... ........ ........... ........ 9 1.1 Objective .... ......... .......... ......... .......... ........ ........... ........ ........... ........ ........... ........ 9 1.2 ...

  • Intel 5400 Series - page 4

    4 Quad-Core Intel® Xeon® Processor 5400 Series TMDG D Safety Requirements .............. ........ ........... ........ ......... .......... ......... .......... ......... ........89 E Quality and Reliab ility Requirements .. ........ ........... ........ ........ ........... ........ ........... .... 91 E.1 Intel Verification Criteria for the Ref ...

  • Intel 5400 Series - page 5

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 5 B-5 CEK Sp ring (Sheet 1 of 3) ......... .......... ........... ........ ........... ........ ........... .......... .... 62 B-6 CEK Sp ring (Sheet 2 of 3) ......... .......... ........... ........ ........... ........ ........... .......... .... 63 B-7 CEK Sp ring (Sheet 3 of 3) ......... ..... ...

  • Intel 5400 Series - page 6

    6 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Tables 1-1 Referen ce Documents... .......... ......... .......... ......... .......... ......... .......... ......... .......... . 9 1-2 Terms and Descriptions .... ........... ........ .......... ........... ........ ........... ........... ........ .... 10 2-1 Processor Mechanical Parameters ...

  • Intel 5400 Series - page 7

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 7 Revision History § Reference Number Revision Number Description Date 318611 001 Initial release of the document. November 2007 ...

  • Intel 5400 Series - page 8

    8 Quad-Core Intel® Xeon® Processor 5400 Series TMDG ...

  • Intel 5400 Series - page 9

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 9 Introduction 1 Introduction 1.1 Objective The purpose of this guide is to describe the reference thermal solution and design parameters required for the Quad-Core Intel® Xeon® Processor 5400 Series. It is also the intent of this document to comprehend and demonstr ate the processor cooling sol ...

  • Intel 5400 Series - page 10

    Introduction 10 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Note: Contact your Intel field sales repr esentative for the latest revision and orde r number o f this doc ument. 1.4 Definition of Terms Clovertown_Harper town_Wolfdale-DP Processor Enabled C omponents CEK Thermal Models (in Flotherm* and Icepak*) Av ailable electronically Clover ...

  • Intel 5400 Series - page 11

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 11 Introduction § T CONTROL A processo r unique v alue for use in fan spe ed control mechanisms. T CONTROL is a temperature specification based o n a temperature reading from the p rocessor ’s Digital Thermal Sensor . T CONTROL can be described as a trig ger point for fan speed co ntrol impleme ...

  • Intel 5400 Series - page 12

    Introduction 12 Quad-Core Intel® Xeon® Processor 5400 Series TMDG ...

  • Intel 5400 Series - page 13

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 13 Thermal/Mechanical Reference Design 2 Thermal/Mechanical Reference Design This chapter describes the thermal/mechanic al reference design for Quad-Core Intel® X eon® Processor 5400 Series. Both Quad-Cor e Intel® Xeon® Processor X5400 Series and Quad-Core Intel® X eon® Processor E5400 Seri ...

  • Intel 5400 Series - page 14

    Thermal/Mechanical Reference Design 14 Quad-Core Intel® Xeon® Processor 5400 Series TMDG 2.1.2 Quad-Core Intel® Xeon® Processor 5400 Series Package The Quad-Core Intel® X eon® Processor 5400 Series is packaged using the flip-chip land grid array (FC -LGA) package technology . Please refer to the Quad-Core Intel® Xeon® Processor 5400 Series ...

  • Intel 5400 Series - page 15

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 15 Thermal/Mechanical Reference Design Note: Guidelines on potential IHS flatness variat ion wi th socket load plate actuation and installation of the cooling solution are available in the processor Therma l/Mechanical Design Guidelines. Figure 2-1. Quad-Core Intel® Xeon® Processor 5400 Series M ...

  • Intel 5400 Series - page 16

    Thermal/Mechanical Reference Design 16 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure 2-2. Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (2 of 3) ...

  • Intel 5400 Series - page 17

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 17 Thermal/Mechanical Reference Design Note: The optional dimple pac king marking highlighted by Detail F from th e above dr awing may only be found on initial processors. Figure 2-3. Quad-Core Intel® Xeon® Processor 5400 Series Mechanic al Drawing (3 of 3) ...

  • Intel 5400 Series - page 18

    Thermal/Mechanical Reference Design 18 Quad-Core Intel® Xeon® Processor 5400 Series TMDG The package includes an integr ated heat spreader (IHS). The IHS tr ansfers the non- uniform heat from the die to the top of the IHS, out of which th e heat flux is more uniform and spreads over a larger surface area (not the entire IHS area). This allows mor ...

  • Intel 5400 Series - page 19

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 19 Thermal/Mechanical Reference Design A potential mechanical solution for heavy heatsinks is th e direct attachment of the heatsink to the chassis pan. In this case, the strength of the chassis pan can be utilized rather than solely relying on the basebo ard strength. In addition to the general g ...

  • Intel 5400 Series - page 20

    Thermal/Mechanical Reference Design 20 Quad-Core Intel® Xeon® Processor 5400 Series TMDG processor operating frequency (via the bus multiplier) and input v oltage (via the VID signals). Please refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet for further details on TM and TM2. PROCHO T# is designed to assert at or a few degree ...

  • Intel 5400 Series - page 21

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 21 Thermal/Mechanical Reference Design smaller foot print and decreased sensitivity to noise. These D TS benefits will result in more accurate fan speed control and T CC ac tivation.Th e DTS app lication in fan speed control will be discussed in more detail in Section 2.4.1 . 2.2.3 Platform Enviro ...

  • Intel 5400 Series - page 22

    Thermal/Mechanical Reference Design 22 Quad-Core Intel® Xeon® Processor 5400 Series TMDG 2.2.4.2 Thermal Mo nitor fo r Multiple Core Products The thermal management for multiple core products has only one T CONTROL va lu e pe r processor . The T CONTROL for processor 0 and T CON TROL for processor 1 are independent from each other . If the D TS t ...

  • Intel 5400 Series - page 23

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 23 Thermal/Mechanical Reference Design Figure 2-6. Processor Core Geometric Center Locations X1 , X2, X3 , X4 Y X Y2 Y3 Y4 Y1 Cor e1 Cor e2 Cor e3 Cor e4 X1 , X2, X3 , X4 Y X Y2 Y3 Y4 Y1 Cor e1 Cor e2 Cor e3 Cor e4 Table 2-3. Processor Core Geometric Center Dimensions Feature X Dimension Y Dimensi ...

  • Intel 5400 Series - page 24

    Thermal/Mechanical Reference Design 24 Quad-Core Intel® Xeon® Processor 5400 Series TMDG 2.2.5 Thermal Profile The thermal profile is a line that defines the relationship between a processor’ s case temperature and its power consumption as shown in Figure 2-7 . The equation of the thermal profile is defined as: Equation 2-1.y = ax + b Where: y ...

  • Intel 5400 Series - page 25

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 25 Thermal/Mechanical Reference Design above, the case-to-ambient resistance represents the slope of the line and the processor local ambient temperature represents the y- axis intercept. Hence the T CA SE_MAX value of a specific solution can be ca lculated at TDP . Once this point is determined, ...

  • Intel 5400 Series - page 26

    Thermal/Mechanical Reference Design 26 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure 2-9 depicts the interaction between the Thermal Profile a nd T CO NTROL . If the D TS temperature is less than T CO NTROL , then the case temp erature is permitted to exceed the Thermal Profile, but the D TS temper ature must remain at or below T CONT ...

  • Intel 5400 Series - page 27

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 27 Thermal/Mechanical Reference Design The Thermal Profile A is based on Intel’ s 2U+ air cooling solution. Designing to Thermal Profile A ensures that no measurable performance loss due to Thermal Control Circuit (TCC) activ ation is observed in the processo r . It is expected that TCC would on ...

  • Intel 5400 Series - page 28

    Thermal/Mechanical Reference Design 28 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet or Section 2.2.8 for the Thermal Profile A and Th ermal Profile B specifications. Section 2.5 of this document also provides details on the 2U+ and 1U Intel reference thermal solutions that ...

  • Intel 5400 Series - page 29

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 29 Thermal/Mechanical Reference Design Notes: 1. The The thermal spec ifications shown in this graph ar e for Quad-Core Intel® Xeon ® Processor X5400 Series exc ept the Quad-Co re Intel® Xeon® P rocessor X548 2 sku . 2. Refer to th e Quad-Core Intel® Xeon® Processor 5400 Series Datasheet for ...

  • Intel 5400 Series - page 30

    Thermal/Mechanical Reference Design 30 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Note: The thermal specifications sh own in this gr aph are for reference only . Refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet for the Thermal Profile specificat ions. In case of conflict, the data information in the datasheet supersede ...

  • Intel 5400 Series - page 31

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 31 Thermal/Mechanical Reference Design Ta b l e 2 - 4 and Ta b l e 2 - 5 describe the thermal performance target for the Quad-Core Intel® Xeon® Processor 5400 Series cooling solution enabled by Intel. Figure 2-13. Thermal Profile for Quad-Core Intel® Xeon ® Processor X5482 Series T h er mal P ...

  • Intel 5400 Series - page 32

    Thermal/Mechanical Reference Design 32 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Note: Intel does not enable refer ence heat sink for the Quad-Core Intel® Xeon® Processor X5482 with 150W TDP. The Intel 2U CEK is capable of meeting the thermal specification when local ambient temperature (T LA ) is maintained at or below 35 ° C. 2.3 Fan ...

  • Intel 5400 Series - page 33

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 33 Thermal/Mechanical Reference Design 2.4 Characterizing Cooling Solution Performance Requirements 2.4.1 Fan Speed Control F an speed control (FSC) techniques to reduce system level acoustic noise are a common pr actice in server designs. The fan speed is one of the par ameters that determine the ...

  • Intel 5400 Series - page 34

    Thermal/Mechanical Reference Design 34 Quad-Core Intel® Xeon® Processor 5400 Series TMDG There are many different ways of implementi ng fan speed control, including FSC based on processor ambient temperature, FSC based on processor Digital Thermal Sensor (DT S) temperature or a combination of the tw o. If FSC is based only on the processor ambien ...

  • Intel 5400 Series - page 35

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 35 Thermal/Mechanical Reference Design The case-to-local ambient thermal characterization parameter of the processor , Ψ CA , is comprised of Ψ CS , the TIM thermal char acterization parameter , and of Ψ SA , the sink -to- local ambient thermal characterization parameter: Equation 2-4. Ψ CA = ...

  • Intel 5400 Series - page 36

    Thermal/Mechanical Reference Design 36 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Assume the datasheet TDP is 85 W and the case temperature specification is 68 °C. Assume as well that the system airflow has be en designed such that the local processor ambient temperature is 45°C. Then the following could be calculated using equation (2-3 ...

  • Intel 5400 Series - page 37

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 37 Thermal/Mechanical Reference Design T o develop a reliable, cost-effectiv e thermal solution, thermal char acterization and simulation should be carried out at the enti re system level, accounting for the thermal requirements of each component. In additi on, acoustic noise constraints may limit ...

  • Intel 5400 Series - page 38

    Thermal/Mechanical Reference Design 38 Quad-Core Intel® Xeon® Processor 5400 Series TMDG 2.5.2 Thermal Interface Material TIM application between the processor IHS and the heatsink base is generally required to improve thermal conduction from the IHS to the heatsink. Many therm al interface materials can be pre-applied to the heatsink base prior ...

  • Intel 5400 Series - page 39

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 39 Thermal/Mechanical Reference Design 2.5.4 Assembly Overview of the Intel Refe rence Thermal Mechanical De sign The reference design heatsinks that meet the Quad-Core Intel® X eon® Processor 5400 Series thermal performance targets ar e called the Common Enabling Kit (CEK) heatsinks, and are av ...

  • Intel 5400 Series - page 40

    Thermal/Mechanical Reference Design 40 Quad-Core Intel® Xeon® Processor 5400 Series TMDG The CEK reference thermal solution is design ed to extend air-cooling capability through the use of larger heatsinks with minimal airflow blockage and bypass. CEK retention solution can allow the use of much heavier heatsink masses compared to the legacy limi ...

  • Intel 5400 Series - page 41

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 41 Thermal/Mechanical Reference Design CEK, are now commonly using direct chas sis attach (DCA) as the mechanical retention design. The mass of the new thermal solution s is large enough to require consideration for structural support and stiffening on the ch assis. 2.5.5 Thermal Solution Performa ...

  • Intel 5400 Series - page 42

    Thermal/Mechanical Reference Design 42 Quad-Core Intel® Xeon® Processor 5400 Series TMDG 2.5.6 Thermal Profile Adherence The 2U+ CEK Intel reference thermal solution is designed to meet the Th ermal Profile A for the Quad-Core Intel® X eon® Processor 5400 Series. From Ta b l e 2 - 4 , the three- sigma (mean+3sigma) performance of the thermal so ...

  • Intel 5400 Series - page 43

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 43 Thermal/Mechanical Reference Design The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile B for the Quad-Core Intel® Xeon® Processor X5400 Series. From Ta b l e 2 - 7 the three- sigma (mean+3sigma) performance of the thermal solution is computed to be 0.246°C/W ...

  • Intel 5400 Series - page 44

    Thermal/Mechanical Reference Design 44 Quad-Core Intel® Xeon® Processor 5400 Series TMDG The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile specification for the Quad-Core Intel® Xeon® Processor E5400 Series. From Ta b l e 2 - 7 the three-sigma (mean+3sigma) performance of the thermal solution is computed to be ...

  • Intel 5400 Series - page 45

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 45 Thermal/Mechanical Reference Design Note: Intel has also developed an 1U alternat ive reference heatsink de sign. This alternative heatsink design meets the thermal profile specifications of the Quad-Core Intel® Xeon® Proces sor E5400 Series and off ers the advantages of weight reduction and ...

  • Intel 5400 Series - page 46

    Thermal/Mechanical Reference Design 46 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Note: Ref er t o Appendix B for more detailed m echanical drawings of the heatsink. . Note: Ref er t o Appendix B for more detailed m echanical drawings of the heatsink. The function of the standoffs is to provide a bridge between the chassis and the heatsink ...

  • Intel 5400 Series - page 47

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 47 Thermal/Mechanical Reference Design Although the CEK heatsink fits into the legacy volumetric k eep-in, it has a larger footprint due to the elimination of retent ion mechanism and clips used in the older enabled thermal/mechanical components. This allows the heatsink to grow its base and fin d ...

  • Intel 5400 Series - page 48

    Thermal/Mechanical Reference Design 48 Quad-Core Intel® Xeon® Processor 5400 Series TMDG 2.5.7.3 CEK Sp ring The CEK spring, which is attached on the se condary side of the baseboard, is made from 0.80 mm [0.0315 in.] thick 301 stainless steel half hard. Any future versions of the spring will be made from a similar material. The CEK spring has fo ...

  • Intel 5400 Series - page 49

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 49 Thermal/Mechanical Reference Design 2.5.8 Boxed Active Thermal Solu tion for the Quad-Core Intel® Xeon® Processor 5400 Series Th ermal Profile Intel will provide a 2U passive and a 1U passiv e/active heatsink solution for bo xed Quad-Core Intel® Xeon® Processor 5400 Series. This active heat ...

  • Intel 5400 Series - page 50

    Thermal/Mechanical Reference Design 50 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Clear ance is required around the heats ink to en sure unimpeded airflow for proper cooling. The physical baseboard keepout requ irements for the active solution are the same as the passive CEK solution shown in Appendix B . Refer to Figure B-18 th rough Figu ...

  • Intel 5400 Series - page 51

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 51 Thermal/Mechanical Reference Design 2.5.8.2 Systems Considerations Associated with the Active CEK This heatsink was designed to help pedestal chassis users to meet the processor thermal requirements without the use of chassis ducting. It may be necessary to implement some form of chassis air gu ...

  • Intel 5400 Series - page 52

    Thermal/Mechanical Reference Design 52 Quad-Core Intel® Xeon® Processor 5400 Series TMDG The other items listed in Figure 2-16 that are required to complete this solution will be shipped with either the chassis or boards. They are as follows: • CEK Spring (supplied by base board vendors) • Heatsink standoffs (supplied by chassis vendors) § ...

  • Intel 5400 Series - page 53

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 53 1U Alternative Heatsink Thermal/Mechanical D esign A1 U A l t e r n a t i v e H e a t s i n k Thermal/Mechanical Design Intel has also developed an 1U alternat iv e reference heatsink design for the volumetrically constr ained form factor and targeted for the rack -optimized and ultra dense SKU ...

  • Intel 5400 Series - page 54

    1U Alternative Heatsink Thermal/Mechanical Design 54 Quad-Core Intel® Xeon® Processor 5400 Series TMDG A.2 Thermal Solution Performance Characterics Figure A-2 s hows the performance of the 1U altern ative heatsink. This figure shows the thermal performance and the pressure drop through fins of the heatsink versus the airflow pro vided. The best ...

  • Intel 5400 Series - page 55

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 55 1U Alternative Heatsink Thermal/Mechanical D esign x = Processor pow er value (W) Figure A-3 below shows the comparison of this reference thermal solution’ s Thermal Profile to the Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile specification. The 1U alternative solution meets ...

  • Intel 5400 Series - page 56

    1U Alternative Heatsink Thermal/Mechanical Design 56 Quad-Core Intel® Xeon® Processor 5400 Series TMDG ...

  • Intel 5400 Series - page 57

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 57 Mechanical Drawings B Mechanical Drawings The mechanical drawings included in this appendix refer to the thermal mechanical enabling components for the Quad-Core Intel® Xeon® Processor 5400 Series. Note: Intel reserves the right to mak e changes and modifications to the design as necessary . ...

  • Intel 5400 Series - page 58

    Mechanical Drawings 58 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure B-1. 2U CEK Heatsink (Sheet 1 of 4) ...

  • Intel 5400 Series - page 59

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 59 Mechanical Drawings Figure B-2. 2U CEK Heatsink (Sheet 2 of 4) ...

  • Intel 5400 Series - page 60

    Mechanical Drawings 60 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure B-3. 2U CEK Heatsink (Sheet 3 of 4) ...

  • Intel 5400 Series - page 61

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 61 Mechanical Drawings Figure B-4. 2U CEK Heatsink (Sheet 4 of 4) ...

  • Intel 5400 Series - page 62

    Mechanical Drawings 62 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure B-5. CEK Spring (She et 1 of 3) ...

  • Intel 5400 Series - page 63

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 63 Mechanical Drawings Figure B-6. CEK Spring (Sheet 2 of 3) ...

  • Intel 5400 Series - page 64

    Mechanical Drawings 64 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure B-7. CEK Spring (She et 3 of 3) ...

  • Intel 5400 Series - page 65

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 65 Mechanical Drawings Figure B-8. Baseboard Keep out Footprint Definition and Height Restrictions for Enabling Components (Sheet 1 of 6) ...

  • Intel 5400 Series - page 66

    Mechanical Drawings 66 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure B-9. Baseboard Keep out Footprint Definition an d Height Restrictions for Enabling Components (Sheet 2 of 6) ...

  • Intel 5400 Series - page 67

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 67 Mechanical Drawings Figure B-10. Baseboard Keep out Footprint Definition and Height Restrictio ns for Enabling Components (Sheet 3 of 6) ...

  • Intel 5400 Series - page 68

    Mechanical Drawings 68 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure B-11. Baseboard Keep out Footprint Definition an d Height Restrictions for Enabling Components (Sheet 4 of 6) ...

  • Intel 5400 Series - page 69

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 69 Mechanical Drawings Figure B-12. Baseboard Keep out Footprint Definition and Height Restrictio ns for Enabling Components (Sheet 5 of 6) ...

  • Intel 5400 Series - page 70

    Mechanical Drawings 70 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure B-13. Baseboard Keep out Footprint Definition an d Height Restrictions for Enabling Components (Sheet 6 of 6) ...

  • Intel 5400 Series - page 71

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 71 Mechanical Drawings Figure B-14. 1U CEK Heatsink (Sheet 1 of 4 ) ...

  • Intel 5400 Series - page 72

    Mechanical Drawings 72 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure B-15. 1U CEK Heatsink (Sheet 2 of 4) ...

  • Intel 5400 Series - page 73

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 73 Mechanical Drawings Figure B-16. 1U CEK Heatsink (Sheet 3 of 4 ) ...

  • Intel 5400 Series - page 74

    Mechanical Drawings 74 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure B-17. 1U CEK Heatsink (Sheet 4 of 4) ...

  • Intel 5400 Series - page 75

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 75 Mechanical Drawings Figure B-18. Acti ve CEK Thermal So lution Volumetric (Sheet 1 of 3) ...

  • Intel 5400 Series - page 76

    Mechanical Drawings 76 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure B-19. Active CEK Thermal So lution Volumetric (Sheet 2 of 3) ...

  • Intel 5400 Series - page 77

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 77 Mechanical Drawings Figure B-20. Acti ve CEK Thermal So lution Volumetric (Sheet 3 of 3) ...

  • Intel 5400 Series - page 78

    Mechanical Drawings 78 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure B-21. 1U Alternati ve Heatsink (1 of 4) ...

  • Intel 5400 Series - page 79

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 79 Mechanical Drawings Figure B-22. 1U Altern ative Heatsink (2 of 4) ...

  • Intel 5400 Series - page 80

    Mechanical Drawings 80 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure B-23. 1U Alternati ve Heatsink (3 of 4) ...

  • Intel 5400 Series - page 81

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 81 Mechanical Drawings Figure B-24. 1U Altern ative Heatsink (4 of 4) ...

  • Intel 5400 Series - page 82

    Mechanical Drawings 82 Quad-Core Intel® Xeon® Processor 5400 Series TMDG § ...

  • Intel 5400 Series - page 83

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 83 Heatsink Clip Load Methodology C Heatsink Clip Load Methodology C.1 Overview This section describes a procedure for measuring the load applied by the heatsink/clip/ fastener assembly on a processor package. This procedure is recommended to verify the preload is within the design target range fo ...

  • Intel 5400 Series - page 84

    Heatsink Clip Load Methodology 84 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Alternate Heatsink Sample Preparation As just mentioned, making sure that the load cells have minimum protrusion out of the heatsink base is paramount to meaningful re sults. An alternate method to make sure that the test setup will measure loads representative of ...

  • Intel 5400 Series - page 85

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 85 Heatsink Clip Load Methodology Figure C-2. Load Cell Installation in Ma chined Heatsink Base Pocket - Side Vi ew Figure C-3. Preload Test Configuration Wax to mainta in loa d cell in position during heatsink installation Height of pocket ~ height of select ed load cel l Wax to mainta in loa d c ...

  • Intel 5400 Series - page 86

    Heatsink Clip Load Methodology 86 Quad-Core Intel® Xeon® Processor 5400 Series TMDG C.2.2 Typical Test Equipment For the heatsink clip load measurement, use equiv alent test equipment to the one listed Ta b l e C - 1 . Notes: 1. Select load range depending on expect ed load level. It is usually better , whenever poss ible, t o operat e in the hig ...

  • Intel 5400 Series - page 87

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 87 Heatsink Clip Load Methodology (often on the order of 3 minut es). The time zero reading should be taken at the end of this settling time. 5. Record the preload measurement (total from all three load cells) at the target time and average the v alues over 10 seconds around this target time as we ...

  • Intel 5400 Series - page 88

    Heatsink Clip Load Methodology 88 Quad-Core Intel® Xeon® Processor 5400 Series TMDG ...

  • Intel 5400 Series - page 89

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 89 Safety Requirements D Safety Requirements Heatsink and attachment assemblies shall be consistent with the manufacture of units that meet the safety standards: 1. UL Recognition-approv ed for flammability at the system level. All mechanical and thermal enabling components must be a minimum UL94V ...

  • Intel 5400 Series - page 90

    Safety Requirements 90 Quad-Core Intel® Xeon® Processor 5400 Series TMDG ...

  • Intel 5400 Series - page 91

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 91 Quality and Reliability Requirements E Quality and Reliability Requirements E.1 Intel Verification Criteria for the Reference Designs E.1.1 Reference Heatsink Thermal Ve rification The Intel reference heatsinks will be verified within specific bounda ry conditions using a T TV and the methodolo ...

  • Intel 5400 Series - page 92

    Quality and Reliability Requirements 92 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Note: In the case of a discrep ancy , information in the most recent LGA771 Socket Mechanical Design Guidelines supersedes that in the T able E-1 above. E.1.2.2 Recommended Test Sequence Each test sequence should start with components (i.e. baseboard, heatsi ...

  • Intel 5400 Series - page 93

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 93 Quality and Reliability Requirements 3. No signs of physical damage on baseboard surface due to impact of heatsink. 4. No visible physical damage to the processor package. 5. Successful BIOS/Processor/memory test of post-test samples. 6. Thermal compliance testing to demonstrate that the case t ...

  • Intel 5400 Series - page 94

    Quality and Reliability Requirements 94 Quad-Core Intel® Xeon® Processor 5400 Series TMDG ...

  • Intel 5400 Series - page 95

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 95 Enabled Suppliers Information FE n a b l e d S u p p l i e r s Information F.1 Supplier Information F.1.1 Intel Enabled Suppliers The Intel reference enabling solution fo r Quad-Core Intel® Xe on® Processor 5400 Series is preliminary . The Intel reference so lutions have not been verified to ...

  • Intel 5400 Series - page 96

    Enabled Suppliers Information 96 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Note: CEK771-02-1U is the 1U alternative reference heatsi nk design for Quad-Core Intel® X eon® Processor E5400 Series in volumetrically constr ained form factors. F.1.2 Additional Suppliers The Intel enabled solutions for Quad-Core Intel® X eon® Proces sor 540 ...

  • Intel 5400 Series - page 97

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 97 Enabled Suppliers Information Table F-2. Additional Suppliers for the Qu ad-Core Intel® Xeon® Processor 5400 Series Intel Reference Solution (Sheet 1 of 2) Assembly Component Description Development Suppliers Supplier Contact Info 2U Heatsink Alternative CEK Heatsink Copper Fin, Copper Base A ...

  • Intel 5400 Series - page 98

    Enabled Suppliers Information 98 Quad-Core Intel® Xeon® Processor 5400 Series TMDG 1U Heatsink Alternative CEK Heatsink Copper Fi n, Copper Base Aavid Thermalloy CNDA#2525071 David Huang huang@aavid.com 603-223-1724 Frank Hsue frank.hsu@aa vid.com.tw 886-2-26989888 x306 Copper Fi n, Copper Base - and - Aluminum ADDA CNDA# AP1249 Jungpin Chen jung ...

  • Intel 5400 Series - page 99

    Quad-Core Intel® Xeon® Processor 5400 Series TMDG 99 Enabled Suppliers Information § ...

  • Intel 5400 Series - page 100

    Enabled Suppliers Information 100 Quad-Core Intel® Xeon® Processor 5400 Series TMDG ...

Manufacturer Intel Category Computer Hardware

Documents that we receive from a manufacturer of a Intel 5400 Series can be divided into several groups. They are, among others:
- Intel technical drawings
- 5400 Series manuals
- Intel product data sheets
- information booklets
- or energy labels Intel 5400 Series
All of them are important, but the most important information from the point of view of use of the device are in the user manual Intel 5400 Series.

A group of documents referred to as user manuals is also divided into more specific types, such as: Installation manuals Intel 5400 Series, service manual, brief instructions and user manuals Intel 5400 Series. Depending on your needs, you should look for the document you need. In our website you can view the most popular manual of the product Intel 5400 Series.

Similar manuals

A complete manual for the device Intel 5400 Series, how should it look like?
A manual, also referred to as a user manual, or simply "instructions" is a technical document designed to assist in the use Intel 5400 Series by users. Manuals are usually written by a technical writer, but in a language understandable to all users of Intel 5400 Series.

A complete Intel manual, should contain several basic components. Some of them are less important, such as: cover / title page or copyright page. However, the remaining part should provide us with information that is important from the point of view of the user.

1. Preface and tips on how to use the manual Intel 5400 Series - At the beginning of each manual we should find clues about how to use the guidelines. It should include information about the location of the Contents of the Intel 5400 Series, FAQ or common problems, i.e. places that are most often searched by users in each manual
2. Contents - index of all tips concerning the Intel 5400 Series, that we can find in the current document
3. Tips how to use the basic functions of the device Intel 5400 Series - which should help us in our first steps of using Intel 5400 Series
4. Troubleshooting - systematic sequence of activities that will help us diagnose and subsequently solve the most important problems with Intel 5400 Series
5. FAQ - Frequently Asked Questions
6. Contact detailsInformation about where to look for contact to the manufacturer/service of Intel 5400 Series in a specific country, if it was not possible to solve the problem on our own.

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