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Инструкция обслуживания AMD 1207

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Summary
  • AMD 1207 - page 1

    Advanced Micro Devices Thermal Design Guide for Socket F (1207) Processors 32800 Publicat ion # 3.00 Revision: August 200 6 Issue Date: ...

  • AMD 1207 - page 2

    © 2005 Advanced Micr o Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products. AMD makes no represen tations or warranties with respect to the accuracy or completeness of the contents of th is publication and reserves the right to make changes to specificat ...

  • AMD 1207 - page 3

    Contents 3 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Contents Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Chapter 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

  • AMD 1207 - page 4

    4 Content s 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors 5.3.4 Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 5.3.5 Fans . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 5.3. ...

  • AMD 1207 - page 5

    List of Figures 5 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 List of Figur es Figure 1. The 1207-Pin Socket . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 2. Motherboard Component Height Restrictions for Platforms Using the AMD PIB Thermal Solut ...

  • AMD 1207 - page 6

    6 List of Figures 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 26. Socket F (1207) 2U-4P Socket Outline and So cket Window . . . . . . . . . . . . . . . . . . . . . 56 Figure 27. Socket F (1207) 2U-4P Heat Sink Height Restri ction Zone . . . . . . . . . . . . . . . . . . . . . .57 Figure 28. Socket F (1207 ...

  • AMD 1207 - page 7

    List of T ables 7 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 List of T ables Table 1. Mechanical and Thermal Specifications for Socket F (1207) Processors . . . . . . . . . . . . 13 Table 2. Thermal Solution Design Requirements for Platforms Using Socket F (1207) PIB processors . . . . . . . . . . . . . . . . . ...

  • AMD 1207 - page 8

    8 List of T ables 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors ...

  • AMD 1207 - page 9

    Revision History 9 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Revision History Date Revision Descript ion July 2006 3.00 Initial Public release. ...

  • AMD 1207 - page 10

    10 Revision History 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors ...

  • AMD 1207 - page 11

    Chapter 1 Introduction 1 1 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Chapter 1 Intr oduction This document specifies performance requirements for the design of thermal and mechanical solutions for socket F (1207) processors, uti lizing AMD 64-bit technology . Detailed drawings, descriptions, and design targets ...

  • AMD 1207 - page 12

    12 Introduction Chapter 1 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors ...

  • AMD 1207 - page 13

    Chapter 2 Processor Thermal Solutions 13 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Chapter 2 Pr ocessor Thermal Solutions This chapter describes the thermal solutions fo r systems based on socket F (1207) processors. 2.1 Pr ocessor Specifications The objective of thermal solutions is to maintain the proc essor ...

  • AMD 1207 - page 14

    14 Processor Thermal Solutions Chapter 2 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors 2.2 Socket Description Figure 1 shows a three-dimensional view of th e 1207-pin socket used with socket F (1207) processors. This socket is base d on LGA (land-grid array) technology . The LGA socket has 35 pads x 35 pads on a 1 ...

  • AMD 1207 - page 15

    Chapter 3 Thermal Design of Platfo rms Using the AMD Processor-In-a- Box (PIB) Thermal Solution 15 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Chapter 3 Thermal Design of Platforms Using the AMD Pr ocessor -In-a-Box (PIB) Thermal Solution This chapter describes the motherboard component height restrictions, ther ...

  • AMD 1207 - page 16

    16 Thermal Design of Platforms Using the AMD Processor-In-a- Box (PIB) Thermal Solution Chapter 3 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Depending on the system features and layout, more space around the socket ma y be available for the thermal solution than is shown in Figure 2 on pa ge 15. This space perm ...

  • AMD 1207 - page 17

    Chapter 3 Thermal Design of Platfo rms Using the AMD Processor-In-a- Box (PIB) Thermal Solution 17 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 T a ble 3 lists the parts used in the thermal reference design for the AMD PIB thermal solution for socket F (1207) processors. Figure 3 on page 18 shows an exploded view ...

  • AMD 1207 - page 18

    18 Thermal Design of Platforms Using the AMD Processor-In-a- Box (PIB) Thermal Solution Chapter 3 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 3. Exploded V iew of Thermal Solution AMD PIB Platforms based on Socket F (1207) Processors 3.3.1 Backplate Assembly The backplate is mounted on the ba ckside of th ...

  • AMD 1207 - page 19

    Chapter 3 Thermal Design of Platfo rms Using the AMD Processor-In-a- Box (PIB) Thermal Solution 19 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Note: Do not cut entir ely thr ough the center rib. Doin g so will compr omise the stiffness of the backplate. The plate uses two PennEngineering (PEM) sta ndof fs that s ...

  • AMD 1207 - page 20

    20 Thermal Design of Platforms Using the AMD Processor-In-a- Box (PIB) Thermal Solution Chapter 3 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors ...

  • AMD 1207 - page 21

    Chapter 4 Thermal Design of Custom 1U-2P Systems 21 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 3.00 August 2006 Chapter 4 Thermal Design of Custom 1U-2P Systems This chapter describes the motherboard compone nt-height restrictions, thermal-solution design requirements, sample heat sinks, and attachment methods for custom 1 ...

  • AMD 1207 - page 22

    22 Thermal Design of Custom 1U-2P Systems Chapter 4 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Depending on the system features and layout, more space around the socket ma y be available for the thermal solution than is shown in Figure 4 on pa ge 21. This space permits heat sink designs with better thermal perf ...

  • AMD 1207 - page 23

    Chapter 4 Thermal Design of Custom 1U-2P Systems 23 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 3.00 August 2006 Figure 5 on page 24 shows an explode d view of the components used in the thermal reference design solution for custom 1U-2P systems ba sed on socket F (1207) processors. T able 5. Components for the Pr ocessor T ...

  • AMD 1207 - page 24

    24 Thermal Design of Custom 1U-2P Systems Chapter 4 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 5. Exploded V iew of Thermal Solution for Custom 1U-2P Systems The following sections describe the mechanical requirements of the components shown in Figure 5. 4.3.1 Backplate Assembly For details on the backpl ...

  • AMD 1207 - page 25

    Chapter 4 Thermal Design of Custom 1U-2P Systems 25 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 3.00 August 2006 Lifting the heat sink away from the processor can re sult in damage to the processor contact pads, the socket contacts, or the socket solder-ball joints . Ma intaining the spring force is important for the life o ...

  • AMD 1207 - page 26

    26 Thermal Design of Custom 1U-2P Systems Chapter 4 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Other fan and heat sink co mbinations may yield adequate ther mal performance. The system designer must ensure that the thermal solution provides requ ired cooling for the proce ssor for the given system layout and fl ...

  • AMD 1207 - page 27

    Chapter 4 Thermal Design of Custom 1U-2P Systems 27 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 3.00 August 2006 4.3.5 Thermal Interface Material The heat sink contacts the top surface of the processor package and utilizes the thermal interface material between the processor lid and the heat sink. AMD recommends us ing a hi ...

  • AMD 1207 - page 28

    28 Thermal Design of Custom 1U-2P Systems Chapter 4 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors ...

  • AMD 1207 - page 29

    Chapter 5 Thermal Design of Custom 2U-4P Systems 29 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 August 2006 Chapter 5 Thermal Design of Custom 2U-4P Systems This chapter describes the motherboard compone nt-height restrictions, thermal-solution design requirements, sample heat sinks, and attachment methods for custom 2U-4P ...

  • AMD 1207 - page 30

    30 Thermal Design of Custom 2U-4P Systems Chapter 5 32800 Rev . 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors Depending on the system features and layout, more space around the socket ma y be available for the thermal solution than is shown in Figure 8 on pa ge 29. This space permits heat sink designs with better thermal perf ...

  • AMD 1207 - page 31

    Chapter 5 Thermal Design of Custom 2U-4P Systems 31 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 August 2006 Figure 9 on page 32 shows an explode d view of the components used in the thermal reference design solution for custom 2U-4P systems ba sed on socket F (1207) processors. T able 8. Components for the Pr ocessor Therma ...

  • AMD 1207 - page 32

    32 Thermal Design of Custom 2U-4P Systems Chapter 5 32800 Rev . 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 9. Exploded V iew of Thermal Solution for Custom 2U-4P System Based on Socket F (1207) Processors The following sections describe the mechanical requirements of the components shown in Figure 9. 5.3.1 Backplate ...

  • AMD 1207 - page 33

    Chapter 5 Thermal Design of Custom 2U-4P Systems 33 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 August 2006 5.3.2 Spring Clip The spring clip is designed to apply 75 lbs of for ce to the center of the heat sink. This force is necessary to help prevent the heat sink from lifting of f of the package during shock or vibration- ...

  • AMD 1207 - page 34

    34 Thermal Design of Custom 2U-4P Systems Chapter 5 32800 Rev . 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors the center to 2.5 mm at the edges. The heat sink al so has three heat pipes soldered to the base and connected to the top of the fin stack to improve fin ef ficiency . This design provides optimum heat spreading perfo ...

  • AMD 1207 - page 35

    Chapter 5 Thermal Design of Custom 2U-4P Systems 35 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 August 2006 on flow simulations of an AMD reference 2U system, the flow-through of the heat sink is approximately 18 CFM. Figure 1 1 sh ows that this flow rate corres ponds to a case-to-ambient thermal resistance of 0.22°C/W . T ...

  • AMD 1207 - page 36

    36 Thermal Design of Custom 2U-4P Systems Chapter 5 32800 Rev . 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors ...

  • AMD 1207 - page 37

    Appendix A Keep-Out Drawings for Platforms Us ing the PIB Thermal Solution for Socket F (1207) Processors 37 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Appendix A Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Pr ocessors Appendix A contains detaile d recommended keep-out dra ...

  • AMD 1207 - page 38

    38 Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors Appendix A 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 12. Socket F (1207) PIB Boar d Component Height Restrictions 7 3 . 8 1 1 9 . 9 1 D C B A A B C D 1 2 3 4 5 6 7 8 8 7 5 6 4 3 2 1 S E C I V E D O R C I M D ...

  • AMD 1207 - page 39

    Appendix A Keep-Out Drawings for Platforms Us ing the PIB Thermal Solution for Socket F (1207) Processors 39 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 13. Socket F (1207) PIB Mounting Ho les, Contact Pads, and No-Routing Zone x 2 0 5 4 . 0 0. 000 0. 00 x 2 2 3 . 5 2 2 4 . 1 1 1. 441 36. 59 0. 787 0. 39 ...

  • AMD 1207 - page 40

    40 Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors Appendix A 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 14. Socket F (1207) PIB So cket Outline and Socket Window 0.000 0.00 0.724 18. 3 9 2.189 55. 6 1 0 0 0 . 0 0 0 . 0 19. 9 1 0. 784 8 5 4 . 0 3 6 . 1 1 6 3 ...

  • AMD 1207 - page 41

    Appendix A Keep-Out Drawings for Platforms Us ing the PIB Thermal Solution for Socket F (1207) Processors 41 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 15. Socket F (1207) PIB Heat Sink Height Restriction Zone x 2 4 1 . 0 5 4 7 9 . 1 0. 000 0.00 1. 44 1 2 x 36. 59 1. 26 5 2 x 32. 13 1. 08 6 2 x 27. 59 2. ...

  • AMD 1207 - page 42

    42 Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors Appendix A 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 16. Socket F (1207) PIB Board No-Through-Hole Keep-Out 7 9 4 . 0 3 6 . 2 1 0. 000 0. 00 1. 318 33. 47 2. 885 73. 29 0 0 0 . 0 0 0 . 0 4 4 9 . 1 7 3 . 9 4 ...

  • AMD 1207 - page 43

    Appendix A Keep-Out Drawings for Platforms Us ing the PIB Thermal Solution for Socket F (1207) Processors 43 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 17. Socket F (1207) PIB Board Bottom Side Keep-Out x 2 0 7 5 . 1 0. 000 0. 39 7 2 x 0. 966 24. 54 10. 09 0. 00 1. 318 33. 47 0. 233 1. 33 5 2 x 33. 91 1. ...

  • AMD 1207 - page 44

    44 Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors Appendix A 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors ...

  • AMD 1207 - page 45

    Appendix B Keep-Out Drawings for Cu stom 1U-2P Systems Based on the Socket F (1207) Processor 45 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Appendix B Keep-Out Drawings for Custom 1U- 2P Systems Based on the Socket F (1207) Pr ocessor Appendix B contains detailed recommended keep-out drawings for processo r hea ...

  • AMD 1207 - page 46

    46 Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F (1207) Processor Appendix B 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 18. Socket F (1207) 1U-2P B oard Component Height Restrictions 0 0 . 3 4 . d n u o r g o t e i T ; t h g i e h t n e n o p m o c x a M ] ' ' 0 0 0 . 0 [ 0 0 ...

  • AMD 1207 - page 47

    Appendix B Keep-Out Drawings for Cu stom 1U-2P Systems Based on the Socket F (1207) Processor 47 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 19. Socket F (1207) 1U-2P Mounting Ho les, Contact Pads, and No-Routing Zone x 2 2 3 . 5 2 7 9 9 . 0 0. 000 0. 00 0. 96 6 2 x 24. 54 2. 53 4 2 x 0 0 0 . 0 7 3 . 6 4 ...

  • AMD 1207 - page 48

    48 Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F (1207) Processor Appendix B 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 20. Socket F (1207) 1U-2P So cket Outline and Socket Window 19.9 1 0.784 0 0 0 . 0 0 0 . 0 8 5 4 . 0 3 6 . 1 1 0.000 0.00 1 8 9 . 1 3 3 . 0 5 0.724 18. 39 2.189 55. 6 ...

  • AMD 1207 - page 49

    Appendix B Keep-Out Drawings for Cu stom 1U-2P Systems Based on the Socket F (1207) Processor 49 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 21. Socket F (1207) 1U-2P He at Sink Height Restriction Zone 7 2 8 . 0 0 0 . 1 2 0.000 0. 00 2. 83 4 2 x 0 0 0 . 0 0 0 . 0 71. 98 1. 26 6 2 x 1.681 42. 71 3.249 82. ...

  • AMD 1207 - page 50

    50 Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F (1207) Processor Appendix B 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 22. Socket F (1207) 1U-2P Board No-Through-Hole Keep-Out 6 7 5 . 0 3 6 . 4 1 0. 000 0. 00 1. 598 40 .59 3. 166 80 .41 0 0 0 . 0 0 0 . 0 2 2 0 . 2 7 3 . 1 5 . s t n e ...

  • AMD 1207 - page 51

    Appendix B Keep-Out Drawings for Cu stom 1U-2P Systems Based on the Socket F (1207) Processor 51 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 23. Socket F (1207) 1U -2P Backplate Contact Zone 5. 9 1 2 x 0. 233 0. 000 0. 00 1. 598 40.59 3. 166 80.41 1. 266 32.16 2. 834 71.98 0 0 0 . 0 0 0 . 0 6 7 5 . 0 3 6 ...

  • AMD 1207 - page 52

    52 Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F (1207) Processor Appendix B 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors ...

  • AMD 1207 - page 53

    Appendix C Keep-Out Drawings for Cu stom 2U-4P Systems Based on the Socket F (1207) Processor 53 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Appendix C Keep-Out Drawings for Custom 2U- 4P Systems Based on the Socket F (1207) Pr ocessor Appendix C contains detailed recomm ended keep out drawings for pr ocessor he ...

  • AMD 1207 - page 54

    54 Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F (1207) Processor Appendix C 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 24. Socket F (1207) 2U-4P B oard Component Height Restrictions 0 0 . 3 4 4 2 . 5 1 D C B A A B C D 1 2 3 4 5 6 7 8 8 7 5 6 4 3 2 1 S E C I V E D O R C I M D E C N A V ...

  • AMD 1207 - page 55

    Appendix C Keep-Out Drawings for Cu stom 2U-4P Systems Based on the Socket F (1207) Processor 55 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 25. Socket F (1207) 2U-4P Mounting Ho les, Contact Pads, and No-Routing Zone 3 2 .1 6 1 .2 6 6 0. 000 0. 00 0. 96 6 2 x 1. 866 47.40 24. 54 2. 53 4 2 x 64. 36 x 2 0 ...

  • AMD 1207 - page 56

    56 Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F (1207) Processor Appendix C 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 26. Socket F (1207) 2U-4P So cket Outline and Socket Window 1 9 .9 1 0 .7 8 4 0. 000 0.00 0. 724 18. 39 1. 520 38. 61 2. 189 55. 61 0 0 0 . 0 0 0 . 0 8 5 4 . 0 3 6 . ...

  • AMD 1207 - page 57

    Appendix C Keep-Out Drawings for Cu stom 2U-4P Systems Based on the Socket F (1207) Processor 57 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 27. Socket F (1207) 2U-4P He at Sink Height Restriction Zone 1.266 0. 000 0. 00 2.83 4 2 x 2.260 57.4 1 0. 693 17.59 0 0 0 . 0 0 0 . 0 7 2 6 . 0 2 9 . 5 1 71.98 2 x ...

  • AMD 1207 - page 58

    58 Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F (1207) Processor Appendix C 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 28. Socket F (1207) 2U-4P Board No-Through-Hole Keep-Out 7 9 4 . 0 3 6 . 2 1 0. 000 0.00 1. 598 40.59 3. 166 80.41 0 0 0 . 0 0 0 . 0 4 4 9 . 1 7 3 . 9 4 D C B A A B C ...

  • AMD 1207 - page 59

    Appendix C Keep-Out Drawings for Cu stom 2U-4P Systems Based on the Socket F (1207) Processor 59 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 29. Socket F (1207) 2U -4P Backplate Contact Zone 3 2 1 . 0 0.000 0.00 1.598 40. 59 x 2 3.166 80. 41 0 0 0 . 0 0 0 . 0 6 6 5 . 0 7 3 . 4 1 7 9 4 . 0 3 6 . 2 1 1 8 8 ...

  • AMD 1207 - page 60

    60 Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F (1207) Processor Appendix C 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors ...

  • AMD 1207 - page 61

    Appendix D Flow Simulation Result s for Custom 2U-4P Systems Based on Socket F (1207) Processors 61 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 August 2006 Appendix D Flow Simulation Results for Custom 2U-4P Systems Based on Socket F (1207) Pr ocessors Appendix D describes the flow simulation result s for 2U-4P systems base ...

  • AMD 1207 - page 62

    62 Flow Simulation Results for Custom 2U-4P Systems Based on Socket F (1207) Processors Appendix D 32800 Rev . 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 31. S treamline Plot of AM D Refer ence Custom 2U-4P System Thermal simulation of the 2U-4P system shown in Figure 30 on page 61 with the heat sink and fan describ ...

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Полная инструкция обслуживания устройства AMD 1207, как должна выглядеть?
Инструкция обслуживания, определяемая также как пособие пользователя, или просто "руководство" - это технический документ, цель которого заключается в использовании AMD 1207 пользователями. Инструкции пишет, как правило технический писатель, языком, доступным для всех пользователей AMD 1207.

Полная инструкция обслуживания AMD, должна заключать несколько основных элементов. Часть из них менее важная, как например: обложка / титульный лист или авторские страницы. Однако остальная часть, должна дать нам важную с точки зрения пользователя информацию.

1. Вступление и рекомендации, как пользоваться инструкцией AMD 1207 - В начале каждой инструкции, необходимо найти указания, как пользоваться данным пособием. Здесь должна находится информация, касающаяся местонахождения содержания AMD 1207, FAQ и самых распространенных проблем - то есть мест, которые чаще всего ищут пользователи в каждой инструкции обслуживания
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