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HP (Hewlett-Packard) HP BladeSystem Enclosure technologies - page 1
HP BladeSystem c3000 Enclosure technologies technology brief Abstract .............................................................................................................................................. 2 Overview of HP BladeSystem c3000 Enclosure ....................................................................................... 2 HP ...
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HP (Hewlett-Packard) HP BladeSystem Enclosure technologies - page 2
Abstract The HP BladeSystem c3000 Enclosur e is the next generation in an evolution of the entir e rack- mounted infrastruct ure. The c3000 Encl osure is desi gned for remote sites, small and medium-sized businesses, and data centers with special power and cooling constraints. This technology brief provides an overview of the HP BladeSystem c3 000 ...
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HP (Hewlett-Packard) HP BladeSystem Enclosure technologies - page 3
Table 1. Comparison of components supported by HP BladeSystem c-Class Enclosures Enclosure c3000 c7000 Height 6U 10U Blade orientation Horizontal Vertical Blades supported 8 HH , 4 FH, 6HH/1FH 16 HH, 8 FH Interconnect bays 4 8 Power supplies 6 at up to 1200 watts each 6 at 2250 watts each Active Cool fans 6 10 Enclosure KVM support Yes No CD/DVD su ...
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HP (Hewlett-Packard) HP BladeSystem Enclosure technologies - page 4
Figure 2. HP BladeSystem c3000 Enclosure – rear view HP Thermal Logic technologies with a variety of HP Thermal Logic onnect er view : t Scalable Enclosure Cooling (PARSEC) design undancy modes alancing HP BladeSystem c-Class products have been de signed technologies ― a set of technologies integrated across se rver blades, enclosures, and inte ...
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HP (Hewlett-Packard) HP BladeSystem Enclosure technologies - page 5
Active Cool fans Quite often, dense, full-feat ured, small form-factor servers use very small fans designed to provide localized cooling in the specific area s needed by th e server blade. Because such f ans generate fairly low airflow (in cubic feet per minute, or CFM) at medium backpressure, a single server often requires multiple fans to ensure ...
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HP (Hewlett-Packard) HP BladeSystem Enclosure technologies - page 6
HP PARSEC architecture HP Parallel Redundant Scalable Enclosure Cooling (PARSEC) architecture is a hybrid model for cooling that combines the best of local and centralized cooling in a single system to ensure optimum airflow and cooling for all servers. Density, once a barrier to cooling, is turned into an advantage with HP Thermal Logic technologi ...
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HP (Hewlett-Packard) HP BladeSystem Enclosure technologies - page 7
Figure 5. The c3000 Enclosure fan bay and device bay pop ulation guidelines Thermal Logic for the server blade and enclosure The server blade design uses precise ducting thro ughout the server blade to manage airflow and temperature based on the unique thermal requirement s of all the critical components. The airflow is tightly ducted to ensure tha ...
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HP (Hewlett-Packard) HP BladeSystem Enclosure technologies - page 8
Figure 6. Processor heat sink using fully ducted design (left) and a traditional heat sink in a 1U rack-mount server (right) Instant Thermal Monitoring provides a real-time vi ew of heat, power, and cooling data. The Onboard Administrator retrieves thermal informati on from a ll server blades, storage blades, and interconnect modules in the enclosu ...
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HP (Hewlett-Packard) HP BladeSystem Enclosure technologies - page 9
Figure 7. HP BladeSystem c3000 Enclosure supports up to six power supplies The new, high efficiency H P c3000 power supplie s provide greater than 90 percent efficiency in AC to DC conversion. These power supplies use the ProLia nt universal form factor so they can also be used in other ProLiant servers. Each AC power su pply ships with a standard ...
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HP (Hewlett-Packard) HP BladeSystem Enclosure technologies - page 10
Values obtained from the BladeSystem Power Size r tool are based on worst case loads and are intended for facility planning purposes only. Actu al power consumption will vary with application type, application utilization, and ambient temperatur e. The BladeSystem Power Sizer is available at the following URL: http://www.hp.com/go/blad esystem/powe ...
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HP (Hewlett-Packard) HP BladeSystem Enclosure technologies - page 11
Connecting with no power redundancy configured If no power redundancy is configured, the total power available is define d as the power available from all power supplies installed (six power suppl ies installed = up to 7200W ). Any power supply or AC line failure may cause the syst em to power off. The Onboard Administrator manages power allocati o ...
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HP (Hewlett-Packard) HP BladeSystem Enclosure technologies - page 12
server power consumption, checks it against the power cap goal, and, if necessary, adjusts server performance to maintain an averag e power consumption that is less than or equ al to the power cap goal. This functionality is available on all Intel-based ProLiant server blades. Using the Insight Power Manager (IP M) v1.10 plug -in to Systems Insight ...
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HP (Hewlett-Packard) HP BladeSystem Enclosure technologies - page 13
Figure 10. Traces on the signal midplane can transmit many different types of signals, depending on which interconnect fabrics are used. The right-hand side of th e diagram represents how the signals can be “overlaid” onto the same traces. Each device bay signal connector has a 100-pin conn ector with 64 high-speed si gnal pins hard-wired from ...
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HP (Hewlett-Packard) HP BladeSystem Enclosure technologies - page 14
Figure 11. HP BladeSystem c3000 interconnect bay numbering For interconnect bay mapping purp oses, it does not matter in whic h device bay a server blade is installed. The mezzanine connect ors always connec t to the same inter connect bays. Becaus e the connections between the device bays and the interc onnect bays are hard-wired through the signa ...
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HP (Hewlett-Packard) HP BladeSystem Enclosure technologies - page 15
interconnect. Depending on the configuration requirements, additional mezzanine cards and interconnects can be populated in: • Mezzanine 1 and Interconnect Bay 2 • Mezzanine 2 and Interconnect Bays 3 and 4 • Mezzanine 3 and Interconnect Bays 3 and 4 The full-height server blade ha s four embedded NICs and can accept up to three additional mez ...
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HP (Hewlett-Packard) HP BladeSystem Enclosure technologies - page 16
Figure 13 lists the available conf igur ations for half-height devices installed in device bay N (1–8). Figure 13. Port mapping for HP BladeSystem c3000 half-h eight server blades to interconnect bays Port mapping differs slightly betw een full-height and half-height server blades due to the support for additional mezzanine cards on the full-heig ...
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HP (Hewlett-Packard) HP BladeSystem Enclosure technologies - page 17
Full details about Virtual Connect te chnology are available in the technology brief entitled “HP Virtual Connect technology implementation for the HP BladeSystem c-Class” on the HP technology website at www.hp.com/servers/technology . Enclosure-based DVD ROM The HP BladeSystem c3000 Enclosure has an optional CD/DVD ROM drive that installs in t ...
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HP (Hewlett-Packard) HP BladeSystem Enclosure technologies - page 18
The Onboard Administrator aggregates up to eigh t iLO 2 ports in a c3000 Enclo sure, simplifying cable management and providing a graphical interface to launch individual server iLO management interfaces. The rear of each module has an LED (blue unit identification) that can be enabled locally or remotely and can be used to identify the enclosure f ...
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HP (Hewlett-Packard) HP BladeSystem Enclosure technologies - page 19
• Cooling—The Onboard Administrator makes sure there is sufficient cooling capacity for the ser ver blade or interconnect module by retrieving thermal information from all of the server blades, power supplies, Active Cool fans, and inte rconnect modules in the enclosur e. • Location—The Onboard Administrator checks the loca tions of server ...
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HP (Hewlett-Packard) HP BladeSystem Enclosure technologies - page 20
More information about the Insight Display is avail able in the technology brief entitled “Managing the HP BladeSystem c-Class” at this URL: http://h18004.www1.hp.com/prod ucts/servers/technology/white papers/proliant-servers.html . Web GUI The web GUI uses event-driven, push technology. No scr een refresh is necessary to view fail ures or even ...
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HP (Hewlett-Packard) HP BladeSystem Enclosure technologies - page 21
The enclosure link-do wn port connects to the enclosur e link-up port on the enclos ure below it. The enclosure link- up port connects to the enclosure lin k-down port on the enclosur e above it. Linking the enclosures enables the rack technician to access all the enclosures through the op en link-up/serv ice port. If more c-Class enclosures are ad ...
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HP (Hewlett-Packard) HP BladeSystem Enclosure technologies - page 22
Appendix A. Acronyms in text The following acronyms are used in the text of this document. Table A-1. Acronyms Acronym Acronym expansion AC Alternating current BTU British thermal unit CFM Cubic feet per minute CLI Command line interface DC Direct current DDR Double data rate FC Fibre Channel IB InfiniBand iLO Integrated Lights Out iSCSI Internet S ...
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HP (Hewlett-Packard) HP BladeSystem Enclosure technologies - page 23
Appendix B. Fan, power supply, and device bay population guidelines Figure B-1. HP BladeSystem c3000 Enclosur e – Fan population gu idelines. For correct operation, fans and server blades must be installed in the correct fan bays. The Onboard Administrator will ensure that fans and server/storage blades are correctly placed before allowing system ...
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HP (Hewlett-Packard) HP BladeSystem Enclosure technologies - page 24
Figure B-2. HP BladeSystem c3000 Enclosur e – Power supply population guidelines Table B-1. Power supply placement Number of power supplies Power supply bays used 2 1 a nd 4 4 1, 2, 4, and 5 6 All power supply bays filled Table B-2. Power supply redundancy options Number of power supplies Power supply bays used 1+1 1 and 4 2+1 1, 4, and 2 3+1 1, ...
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HP (Hewlett-Packard) HP BladeSystem Enclosure technologies - page 25
Figure B-3. HP BladeSystem c3000 Enclosure – Full-height server blade device bay numbering. Full--height servers should be populated from bottom to to p when viewing from the front of the enclosure. With four fans, on ly the bottom two device bays can be used; with six fans, all device bays can be used. Figure B-4. HP BladeSystem c3000 Enclosure ...
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HP (Hewlett-Packard) HP BladeSystem Enclosure technologies - page 26
Figure B-5. The c3000 Enclosure is div ided by sheet metal panels into 2 full-height zones. Each horizontal z one is divided vertically by a removable shelf to make a ma ximum of 8 half-height device bays. These zones reflect the PCIe bus mapping in the signal midplane and limit placement of the server blade/storage blade comb ination. The signal m ...
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HP (Hewlett-Packard) HP BladeSystem Enclosure technologies - page 27
27 When installing a companion blade (HP Storag eWorks SB40c Storage Blade, HP PCI Expansion Blade, or HP StorageWorks Ultriu m 448c Tape Blade), the c ompan ion blade can be installed in either of the paired device bays (1/2, 3/4, 5/6, or 7/8) with a half-height server blade installed in the other paired device bay. To install a companion blade wi ...
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HP (Hewlett-Packard) HP BladeSystem Enclosure technologies - page 28
For more information For additional information, refer to the resources listed below. Resource description Web address General HP BladeSystem information http://www.hp.com/go/bladesystem/ HP BladeSystem c-Class documentation http://h71028.www7.hp.com/ente rprise/cache/3 16735-0-0-0- 121.html HP BladeSystem c3000 Enclosure Maintenance and Service Gu ...
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